Researchers at the Solar Energy Research Institute of Singapore (SERIS) at the National University of Singapore (NUS) have announced the development of a significantly low-cost technique to texture nanoscale features on multicrystalline silicon (mc-Si) wafers after diamond-wire wafer cutting.
Heraeus Photovoltaics has introduced a new paste specifically designed for Diamond-Wire-Cut (DWC) multicrystalline solar cells at the PV Taiwan International Photovoltaic Exhibition.
